GEIA HB 0005 2 PDF

Buy GEIA HB (R) Technical Guidelines For Aerospace And High Performance Electronic Systems Containing Lead-Free Solder And Finishes. Find the most up-to-date version of GEIA-STD at Engineering TechAmerica GEIA-HB Technical Guidelines for Aerospace and High Performance Electronic Systems Containing Lead-Free Solder.

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It will take a combination of high-level design strategies and an effective set of guidelines to enable the ADHP engineer to develop mission-successful products and systems. This standard is not included in any packages.

Level 3, which was relevant to equipment designed to be sent into space, prohibited the use of pure tin finishes. Dr Dunn had collected data on whiskering effects over a period of 32 years, using the C-Ring test to introduce tensile and compressive stress, with different metal substrates, barrier layers and tin plating thicknesses, and the results were shortly to be published.

The name was chosen around by a group of engineers from aerospace, defense, and harsh environment ADHE organizations. Subscription pricing is determined by: He distributed copies to delegates, and it is available on-line for free download by clicking here. The deposit characteristics studied were thickness, grain size, morphology, orientation, intermetallic formation and elemental diffusion effects, under varying conditions of temperature, humidity, thermal cycling and applied external stress.

Need more than one copy? Please first verify your email before subscribing to alerts. He went on to discuss the detail requirements of Levels 2B, 2C and 3, with particular reference to the use of conformal coatings to form a physical barrier. Already Subscribed to this document.

Tin Whisker Mitigation Methodologies: Report from SMART Group, Part 1

Possible future work would investigate the effects of vibration and forced air cooling. Furthermore, the guide highlights Pb-free concerns, as they are encountered in the phases which generally reflect the product development cycle used by Aerospace, Defense, and High-Performance systems industries. A whisker one micron in diameter could support a current of 10 mA. Finishes to be avoided were silver, plated tin-copper, any tin plating over brass without a copper or nickel barrier, and bright tin.

This Standard establishes processes for documenting the mitigating steps taken to reduce the harmful effects of tin finishes in electronic systems. Martin Wickham reviewed previous findings and gave an update on current work.

Although equipment designed to go into space was exempt from the RoHS Directive, the reliability of space projects clearly depended on the integrity of PCBs, components and assembly processes. He showed several examples of actual failures, and other instances where whiskers had grown but not yet been detected electrically.

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A remarkable observation was that in some instances it could be several years before whiskers began to grow, depending on the substrate and stress level. The defining standard for tin whisker susceptibility of tin and tin alloy surface finishes was JEDEC Geiaa, an accelerated test used by component manufacturers, but there was some doubt as to the reliability of results since tin whiskering was such an unpredictable phenomenon.

Tin Whisker Mitigation Methodologies: Report from SMART Group, Part 1

Other resources include work performed in to benchmark the Pb-free technical knowledge base as well as develop a roadmap and plan to close those technical data gaps [13, 14]. Engineers will need to “act like engineers” in order to comprehend this information and apply it to their needs.

But higher pulse frequencies could result in greatly accelerated whisker growth, which was believed to be favoured by fine grained columnar structures. This standard is applicable to Aerospace and High Performance electronic applications which procure equipment that may contain Pb-free tin finishes.

Remoteness and the inability to repair systems in situ obviously made the reliability issue even more critical, albeit for example Voyager 1 was still functioning after 39 years in operation. Your Alert Profile lists the documents that will be monitored. A Circuitnet Media Publication. In a recent SMT survey, we asked the following question: And he quoted instances of systems failure in communications satellites originating from tin whiskers.

As the voice of the U. While considerable progress has been made in closing Pb-free knowledge gaps, the challenge of characterizing performance and reliability still needs to be addressed. As Pb-free technology increasingly becomes the standard for electronic interconnects and finishes, engineers must cope with the various challenges posed by this material. With a heavy dependence on COTS to maintain a competitive edge, the industry is heavily influenced by the commercial supply chain and its increasing use of Pb-free materials.

Each batch of eight boards was delivered to consortium partners for coating and returned to NPL for testing. Nine batches had been built to date, together with control assemblies with no coating, all of which had shown extensive whiskering before any evidence was seen on the coated examples.

Using the analogue of two sword-fencers for illustration, Wickham explained different failure modes: With Professor Geoff Wilcox taking over as moderator, Charles Cawthorne began his own presentation by remarking that, since first observed inand despite many years of study, the mechanism of tin whiskering was still not fully understood and predictive modelling was not yet possible.

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The assemblies were constantly monitored at a test voltage of 15 volts with a series resistor to limit current to 15 milliamps. The space environment presented particular challenges to electronic systems: Plated brass, tin-plated brass with a copper barrier layer, tin plated steel, tin-plated steel with a copper barrier layer, all displayed their own characteristics, sometimes predictable, sometimes not, but fused tin plating showed no whisker nucleation on any of these substrates during the 32 years of the study.

A proprietary bright tin plating process was used. Whisker growth was reduced by increasing deposit thickness and by deposition at higher current densities.

The focus is to provide insight and information such that the design will maintain performance requirements for aerospace, defense, and high-performance ADHP products and systems. Tin Whisker Mitigation Methodologies: On behalf of ESA, a working group led by Dr Dunn had produced a comprehensive set of guidelines for creating a lead-free control plan, which described the problems, requirements and methods relevant to the preparation of a plan for companies to control against the use of lead-free components and to ensure that pure tin did not find its way into the manufacturing chain.

There had been a move away from component termination material type, structure and processing as specific mitigation strategies. If the document is revised or amended, you will be notified by email. Strategies were now based on protective barriers, re-finishing of component terminations, and automatic coverage of pure tin finished surfaces by tin-lead solder during the assembly process. Dr Ashworth stressed that these observations related to the particular proprietary electroplating chemistry used in the study, and that other commercial formulations might demonstrate different relationships between current density, deposit microstructure and whisker growth.

Using a tin plating process deliberately chosen for it high propensity to whiskering, NPL had developed a parallel plate test vehicle that had been enabled electrical detection of failure.

Summarizing at a high level, these challenges represent risks associated with 1 durability of the interconnection and 2 deleterious effects of tin whiskers.

Finally, a good number of texts and a continuously increasing amount of data is now available in the open literature. Standards Subsctiption may be the perfect solution. An additional test vehicle had been designed, based on a PCB with 24 SOIC14 packages, assembled using range of techniques, to enable testing for short circuits between adjacent leads on individual component. You may delete a document from your Alert Profile at any time.