IPC Design and Assembly Process Implementation for Ball Grid Arrays ( BGAs). IPCC delivers useful and practical information to anyone currently using BGAs or FBGAs. Many issues have become especially important due to the. Lead-free solder has numerous undesirable characteristics, such as a higher melting point and reduced wetting than its leaded predecessor.
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Based on the input of this committee, I am glad to report that IPC D has been updated to include void-acceptance criteria. When the committee was working on the new C revision, we reviewed the B rev paragraph by paragraph.
For example, there are two common approaches for designing lands for BGA – solder mask-defined and non-solder mask, or copper, defined. Several solutions are recommended, such as putting glue dots or underfilling solder mask defined lands, as well as using excess solder paste at the corners. Their focus on end product reliability prompted the creation of new information that focuses on mechanical as well as thermal stresses.
Design and Assembly of BGAs and Voiding Requirements: IPC 7095 B
IPC is using a tool called SurveyMonkey. However, leaded surface mount and thru-hole component solder joints usually are visually inspected, not X-rayed.
Additionally, he is president of BeamWorks Inc. The standard takes another look at X-ray inspection techniques, which have vastly improved and are often used to examine solder connections that are under the package.
Preview the IPCD table of contents. The miniaturization of these products has altered the reliability consideration as designers have to consider the shock that comes when products are inevitably dropped. There are many reasons for this phenomenon, which stems from new laminate formulations to address the higher lead-free temperatures and thinner layers at the surface creating less resin over the glass reinforcement. Another issue that is covered in detail is head on pillow.
The shock often causes BGA connections ipcc separate. The other area that needs to be revisited is design of land lpc for BGAs.
IPCC Focuses on Changes in BGA Manufacturing
A range of processes have been examined so the standard can give users the latest information on best practices. Click the “I agree” button to continue to use this site. If you participate in the survey, we will provide you with a summary of answers from industry colleagues regarding the use of BGA components. This standard describes design and assembly implementation for ball grid array BGA and fine-pitch BGA FBGA technology, focusing on inspection, repair and reliability issues associated with design and assembly of printed boards using these packages.
Further analysis revealed a fault known as cratering, in which the resin under the copper starts to fracture. This problem is accentuated when large BGA packages have slight bowing at the corners and the stress is produced across those joints. As manufacturers and OEMs grapple with the challenges faced using BGAs with high lead counts and fine pitches, IPC is providing guidance for dealing with this high density. Therefore, voids generally are not detected.
As the chairman of this committee, I invite and welcome your input to help shape this important industry document. Before proceeding with our next revision to IPCwe will conduct a survey, and you can help shape the next revision. These revisions were driven in large part by customer concerns. The IPC committee decided that because it is possible to minimize voids, but almost impossible to eliminate them, it was reasonable to set a limit on acceptance criteria that can be met easily using sensible process parameters.
Based on this data, some people have advocated that voids are good for reliability. Another change in the latest iteration of IPC is that voids in solder joints, although still a concern based on their location, have become more of a process indicator. The recommendations for process improvement have been retained and are now in the Appendix of the document.
The intent is to provide useful and practical information to the industry. It also provides describes how to successfully implement robust design and assembly processes for printed board assemblies using BGAs as well as ways to troubleshoot some common anomalies which can occur during BGA assembly.
IPC-7095C: Design and Assembly Process Implementation for BGAs
The other 0795 that has received considerable attention in this revision is BGA rework using hot air and laser methods, as well as ways to prevent damage to adjacent components. Techniques for controlling temperatures and improving solder reflow are also ipcc.
Ray Prasad of Prasad Consultancy Group spearheaded the effort.
Common causes include contamination, ball or solder paste oxidation, and board warpage. Target audiences for this document are managers, design and process engineers, as well as operators and technicians who deal with electronics assembly, inspection ipcc repair processes. Ball grid arrays are a 0795 interconnection technology for the semiconductors used in many of the handheld portable products. IPCD describes design and assembly implementation for ball grid array BGA and fine-pitch BGA FBGA technology, focusing on inspection, repair and reliability issues associated with design and assembly of printed boards using these 795.
The prevalence of handhelds prompted committee members to focus on the problems that come when small products are dropped. There have been concerns raised in the industry, and it was highly recommended in IPC that solder mask-defined lands are undesirable because they impact reliability adversely.
Design and Assembly of BGAs and Voiding Requirements: IPC B
It is worth noting that voids are not new to BGAs. While looking for other defects during X-ray, invariably some voids are detected. The combination of all the issues drove the development of ipcc C revision to the BGA implementation standard. Originally, many thought that these open circuits were in the solder joint or were caused by peeling copper. Results of the survey will help organize the amendment being discussed for IPC B.