JESDAE_电子/电路_工程科技_专业资料。JEDEC STANDARD High Temperature Storage Life JESDAE (Revision of. JEDEC STANDARD High Temperature Storage Life JESDAC (Revision of JESDAB) NOVEMBER JEDEC SOLID STATE. JESD A J-STD Preconditioning (PC): PC required for SMDs only. JESD A High Temperature Storage Life (HTSL). °C for hrs.
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Thermally activated failure mechanisms are modeled using the Arrhenius Equation for acceleration. Other suggestions for document improvement: By downloading this file the individual agrees not to charge for or resell the resulting material.
Alternatively, application of a knowledge-based test method that reconciles use condition data Ejsd22 and an understanding of reliability models and failure mechanisms JEP can provide the test durations for any selected stress condition in Table a130. Search by Keyword or Document Number. During the test, accelerated stress temperatures are used without electrical conditions applied.
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Degradation of metals includes metallurgical interfaces. JEDEC standards and publications are designed to serve the public interest through jesr22 misunderstandings between manufacturers and purchasers, facilitating interchangeability and improvement of products, and assisting the purchaser in selecting and obtaining with minimum delay the proper product for use by those other than JEDEC members, whether the standard is to be used either domestically or internationally.
High Temperature storage test is typically used to determine the effect of time and temperature, under storage conditions, for thermally jesd2 failure mechanisms of solid state electronic devices, including nonvolatile memory devices data retention failure mechanisms. If the change to a concept involves any words added or deleted excluding deletion of accidentally repeated wordsit is included.
Degradation of metals including metallurgical interfaces. I recommend changes to the following: For nonvolatile memories, the data specified jewd22 retention pattern must be written initially, and then subsequently verified without re-writing.
The electrical s103 measurements shall consist of parametric and functional tests specified in the applicable procurement document. Filter by document type: The devices may be returned to room ambient conditions or any other defined temperature for interim electrical measurements.
Cosmetic package defects and degradation of lead finish, or solderability are not considered valid failure criteria for this stress. Multiple Chip Packages JC Quality and Reliability of Solid Jed22 Products filter. If you can provide input, please complete this form and return to: This test may be destructive, depending on time, temperature and packaging if any.
This test may be destructive, depending on time, temperature and packaging if any. For example Glass Transition Temperature and thermal stability in air of any polymeric materials.
JEDEC standards and publications are designed to serve the public interest through eliminating misunderstandings between manufacturers and purchasers, facilitating interchangeability and improvement of products, and assisting the purchaser in selecting and obtaining with minimum delay the proper product for use by those other than JEDEC members, whether the standard is to be used either jead22 or internationally. Publications Department Wilson Blvd.
For nonvolatile memories, the data specified data retention pattern must be written initially, and then subsequently verified without re-writing. Thermally activated failure mechanisms are modeled using the Arrhenius Equation for acceleration. NC-A high-rate and lon Charge loss in Nonvolatile memories.
Modified text to emphasize that stress duration requirements are stated in qualification documents, such as JESD47 or in customer agreements, and not in this test method. Requirement, clause number Test method number Clause number Fax: Requirement, clause number Test method number The referenced clause number has proven to be: Table 1 — High temperature storage conditions Condition A: Other conditions and durations may be used as appropriate.
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Mechanical damage, such as cracking, chipping, or breaking of the package, as defined in JESDB will be considered a failure, provided that such damage was not induced by fixtures or handling and it is critical to the package performance in the specific application.
As a minimum the following items should be taken into consideration: Learn more and apply today. This test may be jsd22, depending on Time, Temperature and Packaging if any. Current search Search found 2 items. I recommend changes to the following: A margin test may be used to detect data retention degradation.